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Digi-Key Electronics Announces New Distribution Partnership with Mini-Circuits
May 21, 2021 | Digi-Key ElectronicsEstimated reading time: 1 minute
immediate shipment, announced that it has secured a global distribution partnership with Mini-Circuits to offer their industry-leading MMIC product line up of 50 GHz, LTCC filters, baluns and couplers, and patented reflectionless filters.
Mini-Circuits is a leader in radio frequency (RF), microwave and millimeter-wave components and systems, offering a huge portfolio of RF components. Mini-Circuits products are used widely in commercial, industrial, and military applications including: cellular wireless, aerospace, satellite, Mil-Spec, CATV/Broadband, RFID, test instrumentation, diagnostic imaging and many more.
“Digi-Key is thrilled to be an authorized distributor for Mini-Circuits and offer their products in stock and available for immediate shipping,” said David Stein, vice president of global supplier management for Digi-Key. “Mini-Circuits has been a leader in the RF and microwave space for more than 50 years, their vast offering includes the critical building blocks in RF design. We feel this will be a hugely beneficial partnership that only further enables design engineers to choose exactly what they need, when they need it.”
“Many of our customers already use Digi-Key as a preferred point of sale for a variety of parts in their designs,” said Mini-Circuits’ vice president of technical marketing, Steve Scheinkopf. “We believe Digi-Key’s reputation for easy online ordering, in-stock availability and fast delivery align with our commitment to outstanding service, and we’re confident that this new partnership will give Mini-Circuits’ customers even greater flexibility and convenience.”
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Sweeney Ng - CEE PCBSuggested Items
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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