Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Indium Corporation Introduces New Ball-Attach Flux
May 25, 2021 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.
SA-Dip%20flux.jpgWhile the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
WS-823 provides:
- Tackiness suitable for holding solder spheres in place during reflow
- Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
- Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to “missing ball”
- A formula engineered for low-voiding, thereby increasing joint strength
- Good cleanability with room temperature DI water, avoiding the formation of white residue
Share on:
Suggested Items
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
SolderKing Doubles Facility to Meet Growing Demand
02/18/2025 | SolderKingSolderKing, a leading UK manufacturer of soldering materials, has expanded its operations by doubling its facility. The move follows a significant rise in export sales throughout 2024 and reinforces the company’s position as a key supplier of regulatory-compliant soldering solutions across the UK and Europe.
SEHO to Highlight Cutting-Edge Soldering Technology at IPC APEX Expo 2025
02/17/2025 | SEHOSEHO, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is thrilled to present its best-selling selective soldering system SEHO SelectLine-C at the IPC APEX Expo 2025 in Anaheim.
Bridging the Gap: Workforce Collaboration in East Texas
02/13/2025 | Cory Blaylock, IPCIPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in