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MacDermid Alpha Experts Present on Low Temperature Solder Solutions at Virtual Technical Conferences
May 28, 2021 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will present papers on low temperature solder technology and solutions at two upcoming virtual conferences, the Electronic Components and Technology Conference (ECTC) on June 7 and at the Low Temperaure Soldering (LTS) Conference 2021 being held on June 16.
Dr. Traian Cucu, Leader for the Global Applications and Technologies Experts Group, will present “Advanced Low Temperature Alloy Options for Increased Mechanical Performance” as part of the Low Temperature Solder (LTS) – Packaging Challenges of a Next-Generation SMT Interconnect Session at the ECTC on June 7 at 6 pm EDT. In his paper, Dr. Cucu will address the thermomechanical reliability of latest generation low temperature alloys with special emphasis on drop shock and thermal cycling performance. “The work being presented at this conference is critical to the industry, as the recent generation of low temperature solder alloys are engineered materials specificialy developed to address the latest assembly process requirements dictated by newer component designs“, said Cucu.
On June 16, Alan Plant, Regional Applications Manager for Europe, will present “Using LTS for Soldering Through Hole Components“ as part of the Low Temperature Soldering (LTS) Conference 2021. This paper will address the soldering performance of a newly developed Si-Bi based alloy and the preferred flux chemistries that ensure electrochemical reliability is maintained using lower processing temperatures. “The development of this alloy is an example of MacDermid Alpha’s continued commitment to advancing low temperature soldering technology.“ said Plant. In addition to contributing a paper, Macdermid Alpha is also a Platinum Sponsor for the conference.
More information on MacDermid Alpha’s low temperature solutions can be found at the MacDermid Alpha website (MAES). To register for the ECTC conference, visit https://www.ectc.net/. To register for the LTS conference, visit https://lts-conference.com/.
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
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