MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026

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MacDermid Alpha Electronics Solutions will debut ATROX^® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.

Developed for high-volume leadframe manufacturing, ATROX CD 560-1 gives semiconductor manufacturers a practical alternative to traditional silver-based die attach materials, helping address both PFAS concerns and fluctuating silver prices.

With silver prices remaining volatile, many packaging teams are seeking materials that help control cost without sacrificing performance. Using advanced copper-based filler technology, ATROX CD 560-1 combines high performance with more stable pricing that is less exposed to silver market volatility. The material delivers reliable performance across multiple leadframe surface finishes and stable, high throughput dispensing behavior. Its low outgassing can help minimize contamination risk and support strong reliability, giving manufacturers a practical high-performance die attach solution for various semiconductor applications.

Southeast Asia’s semiconductor industry continues to expand semiconductor packaging capacity, increasing demand for scalable materials that integrate efficiently into existing assembly lines. ATROX CD 560-1 is engineered for high-speed automated dispensing, manufacturing flexibility for cure profiles, and consistent processing in leadframe workflows. Its zero-PFAS chemistry helps reduce environmental and regulatory concerns.

“As PFAS restrictions accelerate across Asia and supply chain pressures remain high, customers need materials that support reliability, production speed, and cost stability,” said Senthil Kanagavel, Director, Standard Die Attach, Semiconductor Assembly, MacDermid Alpha Electronics Solutions. “ATROX CD 560-1 is designed to deliver a high-throughput, high- performance solution for leadframe packages. It gives manufacturers a practical zero-PFAS die attach option that can support high yield in demanding applications.”

At Booth 2423, MacDermid Alpha application engineers will demonstrate dispense strategies, needle selection, and integration techniques designed to support takt time and first-pass yield goals. Media and engineering teams can request technical data packages, sample kits, and dispensing optimization support at the booth or through MacDermid Alpha Electronics Solutions at macdermidalpha.com.