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A Look Back at 2025
Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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Incap Joins United Nations Global Compact Initiative
June 1, 2021 | IncapEstimated reading time: Less than a minute
Incap Corporation has joined the United Nations Global Compact initiative to show commitment to implement its Ten Principles and take action in support of the Sustainable Development Goals. Incap is now one of more than 13,000 companies world-wide affirming the dedication of respecting human rights, labour rights, environmental quality, and anti-corruption practices.
“As a globally operating electronics manufacturing services company and growing organisation, sustainable operations are a must in achieving our goals,” said Otto Pukk, President and CEO of Incap Group.
“Acting in a responsible and trustful way is an integral part of our mission, strategy and operations. Our Corporate Responsibility principles, key themes and performance indicators have been formalised in our Corporate Responsibility programme. By focusing on the programme and its key themes, we also support the related United Nations Sustainable Development Goals,” he added.
The monitoring and continuous development of corporate responsibility enable the alignment of the growing organisation with Incap’s values and strategic goals and ensures that the company meets the expectations of various stakeholders. Incap’s Corporate Responsibility programme describes the key environmental, social and economic themes and the UN Sustainable Development Goals relevant to Incap.
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SEMI Responds to U.S. Tariffs on Advanced Semiconductors and Critical Minerals
01/16/2026 | SEMISEMI, the leading industry association representing the global semiconductor and electronics design and manufacturing supply chain, released a statement in response to President Trump signing two Presidential Proclamations addressing U.S. semiconductor and critical mineral supply chains.
The Training Connection’s Bill Graver: Among Four U.S. IPC-6012 Trainers, Setting the Standard in Testing and Training
01/15/2026 | The Training Connection, LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, proud to announce that Bill Graver, IPC Master Trainer with The Training Connection, is one of only four trainers in the United States qualified to teach IPC-6012, the IPC standard governing the performance and qualification of rigid printed circuit boards.
Libra Industries Names Tony Jepson as General Manager of Dallas Facility
01/15/2026 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is proud to announce the appointment of Tony Jepson as the new General Manager of its Dallas, Texas facility.
Koh Young America Marks 15 Years Helping Electronics Manufacturers Shift from Defect Detection to Process Control
01/14/2026 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, today recognized a major milestone for its Americas organization.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
01/14/2026 | I-Connect007The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.