Nolan’s Notes: Our Spotlight on Europe
One World, One Industry: Attending APEX EXPO 2026 Critical for Electronics Manufacturing Leaders
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
METCAL Announces Patent Pending Software Upgrades to GT Series Soldering Systems
June 2, 2021 | MetcalEstimated reading time: 1 minute
METCAL™, a leader in benchtop soldering systems, announces patent pending software updates for their newly launched GT90 and GT120 Soldering Systems.
The GT series soldering systems are the only products in the market to offer the combination of inductive heating technology with adjustable temperature control. This gives the GT systems a significant performance advantage over resistive heating systems, with faster time to temperature, thermal recovery and temperature stability during soldering.
Expanding on their market leading performance with their variable temperature controlled inductive heating systems, Metcal will be releasing software updates allowing users to set temperature profiles for various components or solder joints.
With this patent pending software technicians soldering temperature sensitive components can setup thermal profiles for various component types with the GT family of soldering systems.
“Customers can set profiles with preheat ramp rates, that allow for a more robust soldering solution, preventing damage from thermal shock caused by rapid heating. The capability of handling the most sensitive of components to the most demanding thermal load applications all with one system, enhanced with thermal profiling, brings the most versatile soldering system to the market today,” said Hoa Nguyen, CTO for OK International, the parent company for Metcal.
Metcal GT90 and GT120 systems are offer improved performance over competitive resistive soldering systems and are ideal for production soldering, R&D labs and applications with extremely high thermal loads.
The patent pending software updates will begin in June of 2021, and will be available to customers with existing units.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Microscreen Expands New England Coverage for High-Precision SMT Stencils
03/04/2026 | MicroscreenMicroscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has appointed Yankee Soldering Technology as its representative firm for the New England region.
Indium Corporation to Showcase High-Reliability Solder Technology at APEX EXPO 2026
03/04/2026 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California.
Indium Powers the Future with Advanced Materials Solutions at CIPS 2026
02/26/2026 | Indium CorporationAs a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International Conference on Integrated Power Electronics Systems, March 10-12, in Dresden, Germany.
ITW EAE Releases EcoWave Option for Electrovert Wave Soldering
02/25/2026 | ITW EAEITW EAE announces the launch of the Electrovert EcoWave, a patented next‑generation wave soldering option engineered to deliver significant gains in efficiency, soldering performance, and sustainability.
New SASinno Ultra-i1 Gives K&F Electronics Added Flexibility in Selective Soldering
02/16/2026 | K&F ElectronicsK&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.