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Advanced Electronics Packaging Digest

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Suggested Items

Sony, imec Unveil Backside Connectivity Module for 3D Chip Integration

06/18/2026 | Imec
At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, and Sony Semiconductor Solutions Corporation (Sony) jointly present a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalization technologies.

Kymeta Joins Red Cat Initiative for Maritime Connectivity

05/15/2026 | Globe Newswire
Red Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

NVIDIA, Corning Partner to Boost U.S. AI Manufacturing

05/06/2026 | BUSINESS WIRE
NVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.

Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat

04/13/2026 | Boeing
Boeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.
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