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‘Deepfake’ ComponentsLockheed Martin Installs Second Hentec/RPS Pulsar Solderability Test System
June 2, 2021 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Lockheed Martin has installed a second Pulsar solderability test system. The Pulsar solderability test system is used to determine how well molten solder will wet on solderable surfaces of electronic components and is ideal for high-reliability applications. The Pulsar utilizes the dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder.
An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208. The Hentec/RPS Pulsar dip-and-look test system can also be configured for low-volume lead tinning of component terminations that exhibit poor solderability due to oxidation or prolonged storage.
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