Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Nortech Systems Announces Cooperation, Agreement with Marpé, BIRD Foundation
June 3, 2021 | Nortech SystemsEstimated reading time: 1 minute
Nortech Systems Incorporated announced it has reached a bilateral Cooperation and Project Funding Agreement by and among Nortech Systems, Inc, Marpé Technologies , and the BIRD (Israel-U.S. Binational Industrial Research and Development) Foundation. The agreement provides a conditional grant to Marpé Technologies and Nortech Systems to develop a total-body tele-dermatology scanning system. By using advanced scanning, sophisticated image processing algorithms, and state of the art AI, the system will save lives by reaching more patients through early detection.
Marpé Technologies, an Israel company, and Nortech Systems, a Minnesota company, are working together to bring a diagnostic platform to dermatology with remote AI capabilities. "We are excited to assist Marpé in bringing their prototype skin cancer detection technology to market" said Jay D. Miller, CEO Nortech Systems, "Our unique ability to provide engineering services, supply chain management and manufacturing services will accelerate commercialization of the product."
The BIRD Foundation works to encourage and facilitate cooperation between U.S. and Israeli companies in a wide range of technology sectors and offers funding to selected projects. The Foundation supports projects without receiving any equity or intellectual property rights in the participating companies or in the projects.
Marpé Technologies, based in Haifa, Israel, is a science-based company developing innovative scanners for early detection of skin cancer. Marpé has developed a prototype screening system that will provide full body remote diagnosis and prevention into dermatology, using a Marpé invention - TAD (Technology Aided Dermatology) and AI-CAD (Artificial Intelligence - Computer-Aided Design) based system.
Tovi Bachar, CEO Marpé Technologies, stated, "The project will leverage the expertise of both companies working hand in hand in all aspects of the development and commercialization of the Marpé platform." David Kunin, Chairman of the Board Nortech Systems added, "We are happy to bring two of the leading med device development communities, Israel and Minnesota, together in a joint project."
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.