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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Atotech Experts Will Present at Global Semiconductor & Electronics Forum
June 14, 2021 | AtotechEstimated reading time: Less than a minute
Atotech, a global supplier of specialty chemicals, equipment, software, and services announced that it will be presenting at the upcoming Global Semiconductor & Electronics Forum on Semiconductor innovation, Thursday, June 17, 2021.
Topic this year:
“Technology pushes limits – ECD and electroless deposition additives and tools for next generation advanced packaging” by Dr. Christian Ohde, Global Product Director for Semiconductor, Lead Frame and Connectors.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MKS’ Atotech Drives Integrated Innovation in Electronics Manufacturing
03/02/2026 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech and ESI will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming APEX EXPO, held at the Anaheim Convention Center from March 17-19, 2026.
MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025
10/24/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.