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Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Siemens Case Study Notes ESCATEC Reduced Re-spin Turnaround Times by 96%
June 18, 2021 | ESCATECEstimated reading time: Less than a minute

Siemens has released a case study that highlighted the efficient use of Valor Process Preparation software by fast expanding electronics manufacturing services (EMS) provider, ESCATEC.
The case study noted that ESCATEC successfully reduced re-spin turnaround times by a massive 96% i.e. from 6-8 weeks previously using the standard industry practice of "trial and error" to less than a day currently.
“Valor Process Preparation enables ESCATEC to quickly detect potential design and manufacturing problems at a very early stage. This capability has significantly shortened NPI turnaround times, bringing real benefits to ESCATEC and its customers in terms of time, cost and quality,” notes Patrick Macdonald, CEO of ESCATEC.
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