Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Cicor Obtains New Revolving Loan Facility
June 21, 2021 | CicorEstimated reading time: 1 minute
Cicor, a leading international technology company in the fields of printed circuit boards and hybrid circuits, printed electronics, microelectronics as well as EMS (electronic manufacturing services) based in Boudry (Switzerland), signed a credit agreement on 18 June 2021 for a new revolving credit facility of CHF 80 million and for an additional optional acquisition credit facility of CHF 75 million.
Successful Renegotiation of Syndicated Loan
Cicor is replacing the existing syndicated loan of CHF 75 million due on 30 June 2022, early and at attractive conditions and is increasing it to CHF 80 million.
The new syndicated loan has a term of four years with two one-year extension options. The renewal of the revolving credit facility provides financing and liquidity security and increases Cicor's overall strategic flexibility.
The syndicated loan was structured as a club deal. The banking syndicate comprises a core banking group consisting of Commerzbank AG as mandated arranger and agent, HSBC Trinkaus & Burkhardt AG, Landesbank Baden-Württemberg, Migros Bank AG and Zürcher Kantonalbank.
Additional Optional Acquisition Credit Facility
The new credit agreement also contains an optional acquisition credit line in the amount of CHF 75 million, which, in the event of a future acquisition, is to be used to finance the purchase price and the working capital of the company to be acquired.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.