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Advanced Electronics Packaging Digest

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Tower Semiconductor, Semtech Expand SiGe Partnership for Data Centers

10/23/2026 | Tower Semiconductor
Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, and Semtech Corporation, a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (IoT) devices worldwide, announced an expanded multi-year agreement that builds on the companies’ 20-year partnership.

MKS to Sell Ophir Optics Business to TTM Technologies

10/19/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced that it has entered into a definitive agreement to sell its Ophir® Optics business to TTM Technologies, Inc. in an all-cash transaction for $650 million, subject to customary closing adjustments.

EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics

09/01/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is actively engaged with customers and partners across the rapidly evolving co-packaged optics (CPO) ecosystem to support the needs of hyperscale data centers, AI infrastructure and high-performance computing (HPC) applications.

Custom LIDAR Optics Support Mission-Critical Performance

05/05/2026 | PRNewswire
Meller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.

GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module

05/04/2026 | GlobalFoundries
GlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).
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