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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy

10/26/2026 | Global Electronics Association
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris, a provider of engineering intelligence and electronic-component data.

I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Engineering What’s Next: A Companion Guide to Qnity’s Advanced Electronics Podcast Series, a new publication that expands on the insights shared in the six-part series. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

HDP Welcomes Nittobo as New Member

10/21/2026 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member.

Neways, SRC Partner on Advanced European Defense Technology

10/20/2026 | Neways
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed an agreement with SRC, Inc., a not-for-profit U.S. research and development corporation specializing in developing, manufacturing and servicing advanced defense technologies.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.
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