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Advanced Electronics Packaging Digest

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Fujitsu, IBM Japan Partner to Accelerate Enterprise System Modernization

06/19/2026 | JCN Newswire
Fujitsu Limited and IBM Japan, Ltd. announced that they will accelerate their collaboration in the field of business system modernization in order to advance enterprise digital transformation and address challenges associated with legacy systems.

Foxconn Research's SNOVA Algorithm Advances to NIST Post-Quantum Finals

06/19/2026 | Foxconn
Hon Hai Research Institute (HHRI ) announced a major breakthrough in its post-quantum cryptography ( PQC ) research.

TTM Technologies, Inc. to Acquire Privately-Held, European-Based Swiss Technology Group AG and ILFA GmbH

06/18/2026 | Globe Newswire
TTM Technologies announced the intent to acquire, subject to regulatory approvals, two well established companies in Europe: privately-held Swiss Technology Group AG (STG), headquartered in Zurich, Switzerland, and privately-held ILFA GmbH (ILFA), headquartered in Hannover, Germany, in separate transactions for all-cash consideration.

SEMI Initiative Identifies Hurdles, Opportunities for Clinical Wearable Biosensors

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Breakthroughs in semiconductor technologies and edge AI are accelerating the rapid advancement of wearable biosensors, but despite the pace of innovation, wearables still struggle to scale beyond everyday wellness into clinically accepted healthcare solutions.

Coherent Secures $50M CHIPS LOI to Expand AI Infrastructure Manufacturing

06/18/2026 | Coherent
Coherent Corp., the global photonics leader, today announced it has signed a letter of intent to receive up to $50 million in direct funding under the CHIPS and Science Act from the U.S. Department of Commerce to expand its world-leading 6-inch Indium Phosphide (InP) semiconductor manufacturing facility in Sherman, Texas.
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