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Target Condition: Are Autorouters Friend or Foe?

07/01/2025 | Kelly Dack -- Column: Target Condition
For PCB designers, just hearing the word “autorouters” can trigger everything from eye rolls to heated debate. We all have stories—some painful, some comical—of boards gone sideways at the hands of an overzealous routing algorithm. But these tools aren’t going away, and frankly, they shouldn’t. Used wisely, they can save some project teams hours or even days. Used blindly, they can cost weeks. So, where do autorouting tools stand today, and is interactive routing the smarter path forward?

High Density Packaging User Group (HDP) Welcomes Lincstech as New Member

07/01/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation

07/01/2025 | Zhen Ding
To advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.

EU Defence Electronics Ecosystem Highlighted in Brussels

07/01/2025 | I-Connect007 Editorial Team
In this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.

Smarter Machines Use AOI to Transform PCB Inspections

06/30/2025 | Marcy LaRont, PCB007 Magazine
As automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
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