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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Bay Area Circuits Releases Update to InstantDFM
July 19, 2021 | Bay Area Circuits, Inc.Estimated reading time: 1 minute
Bay Area Circuits, Inc., a leading manufacturer of quick-turn printed circuit boards (PCBs), announced the release of a significant update to its automated, online Design for Manufacturability (DFM) tool, InstantDFM™. In addition to an improved interface and greater accessibility to DFM analysis, InstantDFM now offers printed circuit board designers and buyers the opportunity to price and order PCB manufacturing services through a simple, workflow-style e-commerce experience.
InstantDFM helps users to verify process-critical parameters and general manufacturing readiness, providing automated, intelligent design feedback and recommendations. This includes whether a design requires standard or advanced process capabilities – information invaluable to designers working to limit manufacturing costs and lead time while improving overall design performance and stability.
With the latest update to InstantDFM, once a user has verified the accuracy and manufacturing readiness of the design, they are able to customize the manufacturing specifications with options not otherwise contained in the design data such as material, surface finish, via fill, and other special processes. Leveraging characteristics extracted from the design data along with the user-defined customizations, InstantDFM can then generate an instant price quotation for review. Purchasing can be completed with a simple, one-page checkout process.
“We have long believed that the typical PCB DFM, quoting and ordering experience is far too cumbersome so we reimagined the process to give users an innovative, self-service tool they can use on their own timeline,” said Stephen Garcia, President of Bay Area Circuits. “With the recent update to InstantDFM we’ve enabled users with the power to verify their design, customize according to their needs, and quote and order, all within a matter of minutes.”
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Merlin Circuit Technology Enhances Solder Mask Coating Technology (LPI)
12/10/2024 | Merlin Circuit TechnologyMerlin Circuit Technology has invested in the latest LPI coating system installing the AHK Atomizer. The AHK spray coating system delivers enhanced capability with improved uniformity of coating on the PCB surface and greater encapsulation of copper features.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.