Knocking Down the Bone Pile: The Business Case for Component Reclamation
Global Sourcing Spotlight: The Hidden Power of the Rep Network
Smart Automation: When Traditional Depaneling Methods Reach Their Limits
Hentec Industries/RPS Automation announces that it will exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Ohio Valley Expo & Tech Forum to be held at the Holiday Inn Strongsville, in Strongsville, Ohio on August 25, 2021.
At the SMTA event, Tom Baro, National Sales Manager for Hentec/RPS, will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation. The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.
Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling. The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.
