Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Digi-Key Electronics Announces New Global Distribution Partnership with Red Pitaya
August 31, 2021 | Digi-Key ElectronicsEstimated reading time: 1 minute
Digi-Key Electronics, which offers the world's largest selection of in-stock and ready-to-ship electronic components, announced that it has secured a global distribution partnership with Red Pitaya to offer their @HOME kit, which was created specifically for professors and students working remotely or at home.
The Red Pitaya STEMlab 125-10, on which the @HOME kit is based, is an affordable, all-in-one open-source board, which can replace 12 benchtop lab instruments. Features include Matlab remote control, Labview control, FPGA programming, Jupyter/Python programming, oscilloscope, signal generator, spectrum analyzer, LCR meter, and more.
@HOME is an easy-to-use remote lab or take-home kit because all applications are accessible via a web-based user interface. Furthermore, future operating system updates are completely free of charge.
"We are pleased to bring Red Pitaya's @HOME kit to Digi-Key customers including students and professors," said Y.C. Wang, global academic program director at Digi-Key. "The past year and a half have proven that it's more important than ever to provide flexibility in an education setting, and the @HOME kit offers the versatility and portability to bring lab exercises to remote or at-home settings."
"We developed the @HOME kit for professors, in order to provide a hassle-free learning experience for students," said ?rt Valentin?i?, chief technology officer at Red Pitaya. "We aim to make class preparations easier by also providing free step-by-step teaching examples, and the affordable price tag makes this available for every student."
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Standex Electronics Unveils New Brand Identity to Power the Next Era of Engineering Innovation
10/23/2025 | PRNewswireStandex Electronics, a business segment of Standex International Corporation and a global leader in precision-engineered electronic components, has unveiled a refreshed brand identity that represents the next evolution of its engineering excellence.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.