Ynvisible and PragmatIC Partner to Deliver Flexible Display Modules
September 17, 2021 | Business WireEstimated reading time: 1 minute
Ynvisible Interactive Inc., a fast-growing firm in the Internet of Things (IoT) market, and PragmatIC Semiconductor, a world leader in flexible electronics, have entered into non-binding Technology Partnership and Supply Agreement, for a period of 3 years for services and deliverables of up to 2 Million U.S. dollars, focused on fully integrated flexible display modules.
Many applications in growing markets such as smart packaging and healthcare require a display, for example to provide assurance that the item was transported correctly, or to guarantee authenticity, or simply to provide a read-out of critical data. Traditional displays are inherently expensive, rigid and relatively bulky, which means that they are not suitable for packaging or printed media, or for embedding into mass market devices. Ynvisible’s printed electrochromic technology is ideal for these applications, enabling sustainable ultra-low-power displays in novel thin and flexible form factors.
But the display itself is only part of the puzzle – a driver circuit is also required to determine the behaviour of the display. Until now, this has required a separate silicon integrated circuit (or chip), which is not only cumbersome and expensive but also detracts from the form-factor benefits of a thin and flexible display. Now, Ynvisible will employ a thin and flexible integrated circuit (FlexIC) from PragmatIC Semiconductor, embedded within the printed display to deliver a complete module.
The two companies also see strong synergies in their vision of enabling innovators to create optimised custom designs in a fraction of the time and cost required using traditional electronics. Under the recently signed agreement, PragmatIC will develop and supply a range of FlexICs that Ynvisible will integrate into both standard and customer-bespoke display modules.
“By integrating flexible integrated circuits we can now dramatically enhance the product solutions we offer our customers,” said Michael Robinson, CEO of Ynvisible. “We look forward to working with PragmatIC to deliver a range of flexible display modules that can offer easy integration with enhanced functionality across our verticals of supply chain, play and packaging and medical devices.”
“Ynvisible’s electrochromic display technology is a great match for our thin, flexible chips,” said Scott White, CEO of PragmatIC Semiconductor. “Alongside our FlexIC Foundry, this accelerates our vision of opening up exciting new opportunities beyond RFID, such as smart medical devices and visually interactive packaging.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.
SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift
09/03/2025 | SEMISEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation.
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%
09/01/2025 | TrendForceTrendForce’s latest investigations reveal that global foundry revenue in 2Q25 reached a record US$41.7 billion, up 14.6% QoQ, thanks to China’s consumer subsidy program spurring early stocking, along with upcoming demand for new smartphones, notebooks/PCs, and servers launching in the second half of the year.