Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
I-Connect007 Launches New Micro Webinar Series: ‘Converting Process Data Into Intelligence’ Presented by the Experts at Koh Young
September 27, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
The first episode, “True 3D to Overcome Inspection Challenges” is now available to view. In this 6-minute segment, viewers will learn about the use of True 3D to overcome inspection challenges and accurately identify coplanarity and lead-bridging issues, which are prevalent in small packages and BGAs.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit Converting Process Data Into Intelligence and start watching, free, today!
Share on:
