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Advanced Electronics Packaging Digest

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S-Transistors Raises €2.6M to Advance Scalable Quantum Computing Platform

08/31/2026 | VTT
Newly launched Finnish startup S-Transistors, originating from VTT Technical Research Centre of Finland, has raised €2.6 million in pre-seed funding to pioneer a fundamentally new class of integrated circuits based on superconducting transistors.

NEPCON ASIA 2026: Global Electronics Manufacturers Source Next-Gen Solutions

08/28/2026 | PRNewswire
Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for more than 58% of worldwide electronics production output.

Navitas to Acquire Claros

08/27/2026 | Navitas
Navitas Semiconductor Corporation, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, announced the signing of a definitive agreement to acquire Claros, Inc. (Claros) a power management solutions company developing vertical power delivery (VPD) and integrated voltage regulator (IVR) technology for next-generation AI data centers, in a transaction valued at up to approximately $232.8 million, based on the per share closing price of Navitas’ stock on August 21, 2026.

Renesas Opens Physical AI & Robotics Lab in Beijing

08/27/2026 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the official opening of its Physical AI & Robotics Lab in Beijing, China.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.
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