Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show

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Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.

Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the EV market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry’s drive towards sustainability and longer-lasting products.

The company will showcase the following among its featured products:

Rel-ion™ Products

• Durafuse® LT is a solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
• Indium8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications. 
• Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.

Sintering Paste

• InFORCE® pressure sinter pastes are high-metal, low-organic content sinter materials available in both silver and copper. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, meaning less paste can be used.
• InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
• InBAKE™29 Cu sinter paste is developed for high-power die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE™29 can be sintered either pressureless or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 cycles TCT
• (-40°C–175°C), the die shear strength increases compared to time zero. Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach.

A key element of Indium Corporation’s innovation is the company’s Formic Acid Soldering Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored to next-generation power electronics.

To learn more about Indium Corporation’s solutions for EV and automotive applications, visit our experts at booth 1530 at The Battery Show North America.