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Next Gen Assembly Cleaner and Stencil Cleaner from KYZEN at NEPCON Asia
September 29, 2021 | KyzenEstimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that it will exhibit at NEPCON Asia from Oct. 20-22, 2021 at the World Exhibition & Convention Center (Baoan), China. The team will discuss AQUANOX A4727 Next Generation Aqueous Assembly Cleaner and CYBERSOLV C8882® Solvent-Based Stencil Cleaning Fluid.
AQUANOX A4727 is engineered to be effective, stable and predictable, all day, every day. It is designed for reliable production and assembly operations. The advanced technology provides a stable pH and predictable compatibility throughout its long bath life.
AQUANOX A4727 is the result of thousands of hours of laboratory tests and “live” beta site testing scientifically validating the outstanding RINSABILITY, extended BATH LIFE and consistently reliable, long-term PERFORMANCE advantages. This stable chemistry is proven to be compatible on a wide variety of components, coating, labels and equipment.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees.
C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence. CYBERSOLV C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe and hand cleaning processes. CYBERSOLV C8882 has a flash point over 60°C and evaporates cleanly from the stencil.
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