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I-Connect007 Releases Segment 2 of Koh Young Webinar Series: ‘Converting Process Data Into Intelligence’
October 4, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch and learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Scutchfield and Aduna examine 3D inspection, AI, CFX, connectivity, and smart factory success.
Clocking in at under four minutes, the second episode, “Using IPC-610 to Measure Solder Joints,” is now available to view. True 3D AOI helps to verify solder joint quality with measurement conditions adhering to the various IPC-A-610 standards.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit Converting Process Data Into Intelligence and start watching, free, today!
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