- 
                                  
- 
                            News
                        News Highlights
-  Books
                        Featured Books
- smt007 Magazine
Latest IssuesCurrent Issue  Production Software IntegrationEMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?   Spotlight on IndiaWe invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.   Supply Chain StrategiesA successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception. 
- Articles
- Columns
- Links
- Media kit||| MENU
- smt007 Magazine
MacDermid Alpha Electronics Solutions to Feature High Reliability Preform Solutions at SMTA Austin Expo & Tech Forum
October 7, 2021 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
 
                                                                    The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bondingmaterials, will exhibit at the SMTA Austin Expo & Tech Forum on Tuesday, October 19th at the Norris Conference Center in Austin, Texas.
MacDermid Alpha will feature ALPHA Exactalloy® Tape and Reel Preforms for high reliability applications. With electrical components sizes becoming ever smaller, printing sufficient amounts of solder paste onto miniaturized, overpopulated PCBs has become increasingly challenging. ALPHA Exactalloy Tape and Reel Preforms are specifically designed to overcome these solder volume deficiencies, enhancing the solder joint strength and reliability and providing 100% hole fill.
“ALPHA Exactalloy Tape and Reel Preforms continue to be the go-to solution for solving solder deficiencies experienced in surface mount assemblies. Our customers benefit from the ease of implementation and the instantaneous results for solving solder deficiencies for both surface mount and through-hole components, often eliminating rework,” states Jerry Sidone, Product Manager, Preforms. “Our low temperature lead-free alloy offering (140 °C) makes ALPHA Exactalloy Tape and Reel Preforms the natural choice for secondary soldering applications of temperature sensitive components and the next generation of low temperature assembly applications.”
Additional solutions to be promoted include the latest Alpha and Kester low temperature and high reliability solder pastes and the adhesive, edgebond, and underfill capabilities of the ALPHA HiTech polymer solutions portfolio of products.
For additional information about MacDermid Alpha’s industry-leading assembly products and solutions, please visit MacDermidAlpha.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    