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New Siemens Aprisa IC Place-and-Route Software Version Targets Faster Performance Improvements
October 13, 2021 | SiemensEstimated reading time: 1 minute
 
                                                                    Siemens Digital Industries Software announced that the latest release of its Aprisa™ physical design solution is now available. Aprisa 21.R1 has achieved major performance and technology advancements, including dramatic improvements in both runtime and memory footprint reductions. For customers, these enhancements can translate to lower design costs and faster time-to-market.
The technology advancements available in Aprisa 21.R1 demonstrate Siemens’ commitment to delivering best-in-class physical design Integrated Circuit (IC) solutions to its Electronic Design Automation (EDA) customers. Since completing the acquisition of the Aprisa portfolio in December 2020, Siemens has more than doubled the Aprisa R&D team as part of a substantial investment in the Aprisa technology portfolio.
The latest release of Aprisa targets advanced technology nodes and includes the following milestones and highlights:
- Average full-flow runtime reduction of 30 percent compared to the previous release, and up to 2X faster runtimes for larger, more challenging designs.
- Enhancements to all major place-and-route engines, from placement optimization to clock tree synthesis (CTS) optimization, route optimization and timing analysis. The benefits of these performance enhancements can be observed on almost all IC designs, and especially on large designs with complicated multi-corner multi-mode (MCMM) features. On these challenging designs, Aprisa has proven to run up to 2X faster than the previous generation.
- Up to 60 percent memory footprint reduction; Aprisa has reduced, on average, 30 percent full-flow peak memory usage for large designs, and up to 60 percent for complex designs, compared to the previous generation. This greater efficiency enables even larger designs with complicated MCMM to be completed on servers with less available RAM.
- 6nm/5nm/4nm design enablement. Siemens has collaborated closely with leading foundries to enable Aprisa for advanced nodes. Aprisa is fully certified for 6nm processes, and Siemens has implemented all required design rules and features for the design enablement of 5nm and 4nm nodes. Final certifications, in collaboration with the world’s leading foundry partners, are in progress.
- Extended support for multi-power domain (MPD). The extended functionalities greatly increase the flexibility and completeness of MPD support, which is critical for extreme low-power designs.
“This new release reconfirms Siemens’ commitment to providing truly world class physical design technology to our EDA customers,” said Inki Hong, division director of the Aprisa product line for Siemens Digital Industries Software. “With Aprisa 21.R1, our customers can work more efficiently with larger and more challenging designs than ever before.”
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Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Industry Veteran Dr. Helen Song Joins Celera Semiconductor to Lead Product Design
10/28/2025 | PRNewswireCelera Semiconductor, the analog industry leader using AI to automate the entire product development flow, today announced that Dr. Helen Song has joined the company as vice president of Product Design.
Mapping the EV Landscape: Markets, Platforms, and Powertrains
10/28/2025 | Stanton Rak, SF Rak Companye-Mobility is the defining transformation of 21st-century transportation. As legacy OEMs, startups, and governments race to electrify vehicle fleets, the landscape of e-Mobility is expanding into previously unimaginable territory. But with innovation comes complexity, and with complexity, a need for systems that are not only high-performing but also reliably engineered for the long haul. Understanding the diversity and scale of the EV marketplace is essential to grasping the reliability challenges ahead.
Cadence Reports Q3 2025 Financial Results
10/28/2025 | Cadence Design Systems, Inc.Revenue of $1.339 billion, compared to revenue of $1.215 billion in Q3 2024

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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