Koh Young Technology Exhibiting Award-Winning True 3D Inspection Solutions at NEPCON Asia 2021

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Koh Young, the industry leader in True 3D measurement-based inspections, is participating at Nepcon Asia 2021 being held this year at the Shenzhen World Exhibition & Convention Center (Baoan) from October 20-22, 2021 in Shenzhen China.

This grand exhibition was scheduled to be held on August 25-27 but was postponed to October 20-22 due to the recent spike of the Delta Variant that started in late July. There was a venue change from the Shenzhen Convention & Exhibition Center (Futian) to the Shenzhen World Exhibition & Convention Center (Baoan). This new grand venue spans 70,000 square meters with 12,000 exhibitors and is expected to reach over 75,000 visitors.

Koh Young is exhibiting award-winning solutions at booth 1F45 (Baoan). We are highlighting nine smart factory solutions that solve electronics assembly challenges:

1. KY8030-3: The Industry’s Fastest True 3D Solder Paste Inspection Solution

• Automated Solder Paste Dispensing: The KY8030-3 automatically dispenses paste with its Auto-Rework option. The high-precision and user-friendly dispensing system eliminates costly mistakes due to insufficient solder causing open joints, lean fillets, and weak joints.
• Unmatched Inspection Speed: The KY8030-3 blends Koh Young’s pioneering technologies to provide unmatched inspection speeds. The combination of this system’s throughput and accuracy makes this solution suitable across a vast range of applications.

2. Meister S: Premium In-line 3D Inspection Systems for Ultra-thin Solder Paste Inspection

• Superior Flux Inspection: Combining innovative vision algorithms and high- resolution optics for the semiconductor industries, the Meister S goes beyond solder paste inspection. It is a proven solution for flux inspection.
• Market-proven Ultra-thin Solder Inspection: The Meister S has been qualified for mass production by major semiconductor foundries and micro-LED companies for solder inspection down to 10um with superior Full 3D inspection performance.

3. Meister D: The Industry’s Leading Inspection Systems for Advanced Packaging

• Crack Inspection: The Meister D is a solution targeting die and small MLCCs using an integrated measurement tool with a defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign materials, and more.

4. Zenith F: The Industry’s Best-in-Class True 3D AOI Solution for FPCB Assembly

• FPCB Substrate Handling: The Zenith F is the ideal solution for high-volume FPCB inspection. Due to the thinner and pliable nature of the flexible printed circuit boards, special handling with dedicated expertise is required in comparison to traditional printed circuit boards.
• True 3D Hotbar Inspection: The Zenith F is the industry’s only solution to base its inspection criteria on the IPC-610 standards using True 3D inspection performance for hotbar soldering.

5. Zenith Alpha: The Best Value 3D Automated Optical Inspection Solution

• KAP (Koh Young Auto Programming): The innovative geometry-based KAP software solution reduces the programming process to minimize time to production and reduces costs.
• Whole-board Foreign Material Inspection (WFMI): Inspection goes beyond components and solder joints. The Zenith Alpha combines 2D with True 3D to identify foreign material such as burr, solder balls, chips, and other debris that may lead to costly field failures.

6. KY-P3: Breakthrough in 3D Automated Pin Inspection Solutions

• Versatile Handling Mechanisms: Handling products at the back-end process has proven to be a challenge, yet Koh Young provides a perfect product lineup with versatile handling mechanisms. It offers multiple board and carrier handling solutions to accommodate multiple types of PCBs, connectors, terminals, and even final assemblies with housing pins.

7. Neptune T: Industry’s First 3D Optical Measurement for Transparent Materials

• Non-Destructive 3D Inspection of Coating Thickness: The Neptune T is the industry's first 3D optical measurement instrument for transparent materials and is available for coating, underfill, epoxy, glue, bond material inspection.
• Accurate Thickness Measurement: The Neptune T measures the thickness of transparent and semi-transparent materials

8. KSMART Solutions: True Smart Factory Solution

• Turning Data into Insights: AI-powered KSMART solutions help automate process control while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve metrics, increase quality, and lower costs by eliminating variances, false calls, and escapes.
• Converts Data into Knowledge for effective and quality-driven actions 
• Deliver an AI-powered process analysis and optimization tool
• Achieve an autonomous process optimization facility

9. Koh Young Printer Optimizer (KPO): AI-Powered solution for Printers

• Ultimate Printing Process Reliability & Consistency: With increasing component miniaturization, improving inspection quality, and increasing inspection systems throughput programming is paramount in the industry. Our AI-powered solution not only analyzes current problems but also incorporates machine learning to solve new problems.

To learn more about these award-winning technologies from Koh Young, visit kohyoung.com.

Be sure to check out the free 12-part Webinar Series Converting Process Data Into Intelligence, presented by Koh Young experts Joel Scutchfield and Ivan Aduna and download Koh Young's free eBooks The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond published by I-Connect007.