DuPont Microcircuit Materials Introduces New Silver Pastes for In-Mold Electronics

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DuPont introduced an advanced suite of silver bearing thick film paste conductors to enable In-Mold Electronic devices. The new conductors ME102, ME604 and ME614, have key advancements to improve thermoformability, conductivity and fine line performance. These offerings enable high productivity, improved mechanical and electrical properties allowing extended freedom in the electronic design of In-Mold Electronics devices. These devices include next-generation LiDAR systems for autonomous driving or touch steering wheels with transparent 3D shaped surfaces for enhanced user experience. 

Key advancements of the new ME range include:

• ME102 as a highly conductive thick film conductive paste for antennae, heater and RFID functions
• ME604 as a general-purpose thick film conductive paste with improved thermoformability and conductivity
• ME614 thick film conductive paste with added laser ablation property for very fine line applications

“This innovative new offering demonstrates a range of superior technical properties to meet different customer requirements. We are excited to introduce the ME product range to the market globally and expect a positive impact in accelerating the wider adoption of the emerging In-Mold Electronics technology,” said Peter Weigand, global automotive segment manager, DuPont Microcircuit Materials.

DuPont continues to invest in research, development and intellectual property involving In-Mold paste technology to address customer needs in this growing market. DuPont Microcircuit Materials has over 50 years of experience in the development, manufacture, sale and support of specialized thick film paste compositions for a wide variety of electronic applications in the display, automotive, biomedical, industrial, military and telecommunications markets.