Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Schaeffler Announces New Automotive Manufacturing Facility

02/27/2024 | Schaeffler
Global motion technology company Schaeffler announces the expansion of its operations in the U.S. with the addition of a new manufacturing facility focused on producing automotive electric mobility solutions. This announcement represents the company’s commitment to innovation and growth in the Americas region.

Ansys, Schaeffler Collaboration Drives Sustainable Product Development

02/15/2024 | ANSYS
Ansys and the motion technology company Schaeffler AG announced they are extending their agreement for an additional three years. Schaeffler will rely on Ansys to standardize product development workflows, reduce waste from physical prototypes, and lower the company’s overall carbon footprint through digital transformation.

Siemens’ AM Network to Facilitate Additive Manufacturing Workflow, Collaboration at Schaeffler

11/12/2021 | Siemens
Siemens Digital Industries Software has announced that its Additive Manufacturing Network platform has been implemented at Schaeffler, a global automotive and industrial supplier, to connect its community of design engineers with its AM Fab Shop for additive manufacturing to facilitate collaboration, speed time to production and to foster greater application of the benefits of additive manufacturing (AM) within its value-chain.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in