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SMTAI Pre-Show Interview: Dan Hart of MacDermid Alpha Electronics Solutions
October 21, 2021 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
In this audio interview, I-Connect007's Nolan Johnson speaks with Dan Hart, Application Development Manager for MacDermid Alpha Electronic Solutions, about the paper No Bleed Die Attach to Roughened Leadframe that his team will be presenting at SMTA International 2021 in early November. Dan and Nolan discuss the work that went into the research, and why the MacDermid Alpha team took on this research.
To download the audio (mp3) file, click here.
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