-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Seeed's Open Parts Library (OPL) Adds SnapEDA Models for Faster Electronics Production
October 22, 2021 | PRNewswireEstimated reading time: 2 minutes
Seeed, a leading global electronics manufacturer based in Shenzhen, is adding SnapEDA computer-aided design (CAD) models to the Seeed and Shenzhen Open Parts Libraries (OPLs), to help electronics designers move from idea to fabrication with ease.
The OPLs are a collection of commonly used components, designed to be used with the Seeed Fusion PCB Assembly (PCBA) service, that are widely available in the supply chain, cost effective, and design-for-manufacturing (DFM) friendly. Today it contains a wide selection of over 150,000 commonly used parts, from integrated circuits (ICs) to passives, to cut costs and reduce the turnaround times for turnkey PCB assembly.
During the parts selection stage, the OPLs save engineers time and reduce delays, since the parts are carefully selected to ensure they are widely available in the local supply chain, eliminating the need to import parts and undergo lengthy and costly customs clearance processes. This is especially helpful given the current global component shortage affecting the electronics industry. In addition to preventing delays, engineers also save money since the components in these libraries are sourced from Seeed's affiliated partners network and/or are purchased in bulk.
During the design and manufacturing stage, the addition of the SnapEDA CAD models to the OPLs make them even more valuable. By downloading ready-to-use CAD models for the parts they select, engineers can save weeks of time, and reduce costly prototype iterations during the manufacturing process.
To get started with the new SnapEDA integration, engineers simply visit the Downloads section on the Seeed's OPLs. Once they click the Symbol, Footprint and 3D model link, a viewer will popup allowing engineers to preview the models, and download instantly.
"With the current constraints in the global electronic component supply chain, we're pleased to be able to support the Seeed and ShenZhen open parts libraries, which are helping engineers streamline part selection and manufacturing. With the addition of SnapEDA models, engineers will now be able to design-in these parts in mere seconds," said Natasha Baker, Founder and CEO of SnapEDA.
Before SnapEDA, engineers needed to spend hours of time creating digital models from scratch. With the sheer number of components a project can have, the process of creating and verifying each component can be tedious and error ridden. This is why SnapEDA created the first search engine focused on CAD models, as well as its own patented verification technology to optimize the quality of each model.
Over 15 PCB design formats are accessible with the new SnapEDA integration in the Seeed and ShenZhen OPLs, including Altium, KiCad, Fusion360, Cadence Allegro, OrCAD, EAGLE, DesignSpark PCB, DipTrace, Proteus & more.
Engineers can also find SnapEDA's symbols, footprints and 3D models on the main SnapEDA website, as well as on distributors' websites including Digikey, Mouser, and RS Components' DesignSpark. SnapEDA can also be found in software tools like Autodesk Fusion 360, Proteus and DipTrace. Millions of engineers are benefiting from the syndication of these CAD models on over 30 affiliated partners' platforms.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.