Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies

06/25/2025 | PRNewswire
A new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.

Excellon Installs COBRA Hybrid Laser at Innovative Circuits

06/23/2025 | Excellon
Excellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).

The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.

The Evolution of Picosecond Laser Drilling

06/19/2025 | Marcy LaRont, PCB007 Magazine
Is it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.

Altus, Danutek Expand Partnership with LPKF to Offer Laser Plastic Welding Solutions

05/21/2025 | Altus Group
Altus Group, a leading supplier of capital equipment and service support for the electronics manufacturing sector in the UK and Ireland, and its sister company Danutek, which serves Central and Eastern Europe, are expanding their technology offering through an enhanced partnership with LPKF, a specialist in laser-based manufacturing solutions.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved. Log in