New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect

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STARTEAM GLOBAL Joins IPAI to Advance AI Innovation in PCB Manufacturing

09/16/2026 | STARTEAM GLOBAL
We are pleased to announce that STARTEAM GLOBAL has joined IPAI (Innovation Park Artificial Intelligence), one of Europe’s leading AI innovation hubs dedicated to accelerating the practical application of AI across industries.

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

It’s Only Common Sense: Why Should They Take Your Call?

09/14/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Think about the customer receiving your sales call. She’s dealing with material shortages, changing laminate allocations, extended component lead times, tariff questions, unpredictable transportation costs, and management pressure to protect both delivery and margin. Then the phone rings, and a salesperson asks, “Do you have anything I can quote?” It’s time to rethink that relationship. Call customers because you have information that could help them make a better decision, not because you want an order. Instead of asking, “What can you give me?” you are saying, “Here is something you should know.” Now you are a resource, not an interruption.

Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class

09/10/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, is celebrating an important customer training milestone as Ray Welch, Sr. Applications Engineer at Koh Young America, recently delivered his 100th SPI Level 2 Print Process training class.

Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities

09/08/2026 | Zuken
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design.