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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Aismalibar to Attend productronica 2021
November 2, 2021 | AismalibarEstimated reading time: 2 minutes
The only exhibition of this kind, productronica showcases the entire value chain in electronics manufacturing – from technologies and components to software and services. Over 45,000 professionals attended the conference in 2019 and it continues to grow each year.
After successful participation at productronica 2019, Aismalibar will attend the 2021 Munich event and showcase its latest developments in Thermal laminates for the PCB industry and Thermal Interface Materials.
Aismalibar will showcase in Hall B3, Booth 351 (see map), offering detailed information to those seeking to solve thermal management problems on their PCB designs and offering the ideal solution on high end TIMs.
Aismalibar will present their unique COBRITHERM ULTRATHIN 4W - TG180ºC - 150ºC MOT, an insulated metal substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, containing an innovative 35um ultra-thin polymer-ceramic dielectric layer of its own formulation. This product offers industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, High Tg and Low CTE values, which are the key elements for performance of the MPCB operating at high temperatures.
Furthermore, the Thermal Multilayer product range will be presented, as well as products for the development of multilayer PCBs that can be combined to customize solutions for complex electronic designs and applications. The Thermal Cobritherm THIN LAM and BOND SHEET can be used in standard multilayer lamination processes, reducing thermal resistance, improving thermal conductivity, and dissipating temperature much faster without the need to modifying the design of an existing and running project. This can be achieved only by changing the standard FR4 to Cobritherm THIN LAM and Cobritherm BOND SHEETS.
The new Cobritherm of 3.2W THIN LAM and BOND SHEETS have been developed to reduce thermal resistance. A MOT of 150ºC, high Tg values??of 180ºC and Low CTE below 1.8% (50 to 250ºC) considerably improve overall thermal efficiency. For more information, please visit our website www.aismaibar.com.
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Julia McCaffrey - NCAB GroupSuggested Items
TPCA Launches AI-Powered PCB GPT Knowledge Platform
05/15/2026 | TPCAThe Taiwan Printed Circuit Association (TPCA) has launched the "PCB GPT Industry Knowledge Platform," which uses generative AI to connect PCB professional knowledge services and help the industry improve the efficiency of cross-border and professional talent training.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
STARTEAM GLOBAL Achieves A Score in CDP’s Supplier Engagement Assessment
05/14/2026 | STARTEAM GLOBALSTARTEAM GLOBAL has achieved an A score in CDP’s Supplier Engagement Assessment (SEA).
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
Separating Fact from Fear on the FCC ‘China Lab Ban’
05/14/2026 | Jan Pedersen, NCAB GroupRecent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.