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Aismalibar to Attend productronica 2021
November 2, 2021 | AismalibarEstimated reading time: 1 minute
The only exhibition of this kind, productronica showcases the entire value chain in electronics manufacturing – from technologies and components to software and services. Over 45,000 professionals attended the conference in 2019 and it continues to grow each year.
After successful participation at productronica 2019, Aismalibar will attend the 2021 Munich event and showcase its latest developments in Thermal laminates for the PCB industry and Thermal Interface Materials.
Aismalibar will showcase in Hall B3, Booth 351 (see map), offering detailed information to those seeking to solve thermal management problems on their PCB designs and offering the ideal solution on high end TIMs.
Aismalibar will present their unique COBRITHERM ULTRATHIN 4W - TG180ºC - 150ºC MOT, an insulated metal substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, containing an innovative 35um ultra-thin polymer-ceramic dielectric layer of its own formulation. This product offers industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, High Tg and Low CTE values, which are the key elements for performance of the MPCB operating at high temperatures.
Furthermore, the Thermal Multilayer product range will be presented, as well as products for the development of multilayer PCBs that can be combined to customize solutions for complex electronic designs and applications. The Thermal Cobritherm THIN LAM and BOND SHEET can be used in standard multilayer lamination processes, reducing thermal resistance, improving thermal conductivity, and dissipating temperature much faster without the need to modifying the design of an existing and running project. This can be achieved only by changing the standard FR4 to Cobritherm THIN LAM and Cobritherm BOND SHEETS.
The new Cobritherm of 3.2W THIN LAM and BOND SHEETS have been developed to reduce thermal resistance. A MOT of 150ºC, high Tg values??of 180ºC and Low CTE below 1.8% (50 to 250ºC) considerably improve overall thermal efficiency. For more information, please visit our website www.aismaibar.com.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
08/28/2025 | PRNewswireICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District.
AT&S Fuels Future Innovation with 'Young Wilds' Program
08/28/2025 | AT&SToday’s ideas are tomorrow’s innovations: Following a successful debut in the financial year 2024/25, the “Young Wilds” program offers ambitious young professionals at AT&S the opportunity to take on responsibility and accelerate their personal and professional growth.
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.