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Nordson Completes Acquisition of NDC Technologies
November 3, 2021 | NordsonEstimated reading time: Less than a minute
Nordson Corporation has completed the acquisition of the NDC Technologies business, a leading global provider of precision measurement solutions for in-line manufacturing process control, from Spectris plc.
The completion of the transaction follows the Company’s August 24, 2021, announcement that it had entered into an agreement to acquire the business. This acquisition will expand Nordson’s test and inspection platform into new end markets and adjacent technologies.
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Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
08/18/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S
07/11/2025 | Nordson Test & InspectionNordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania and Estonia.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,