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I-Connect007 Releases Segment 6 of Koh Young Webinar Series: ‘Converting Process Data Into Intelligence’
November 3, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity, and smart factory success.
At just over six minutes, the sixth episode, “MultiPoint Inspection” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, manufacturers will learn how they can further improve line performance with tools for real-time monitoring to instantly display relevant process parameters at remote locations for immediate analysis and action. Combining multi-point views from SPI, pre- and post-reflow AOI with real data management and monitoring allows operators to determine actionable insights to optimize the processes.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit Converting Process Data Into Intelligence and start watching today. This is a free download!
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