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Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)
November 24, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over 8 minutes, the ninth episode, “AI in Action” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit “Converting Process Data Into Intelligence” and start watching, free, today!
Suggested Items
KYZEN to Feature Aqueous Cleaner AQUANOX A4618 at SMTA Expo and Tech Forum
01/23/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Austin Expo and Tech Forum scheduled to take place Thursday, February 6 at the Travis County Exhibition Center in Austin, Texas.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
01/21/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
The Chemical Connection: Better Fabs Attract a Better Workforce
01/23/2025 | Don Ball -- Column: The Chemical ConnectionWorkforce problems are almost as great an issue in PCB manufacturing today as the product quality and reliability of the increasingly complex circuit boards now in demand. I believe they are directly related. A quality workforce makes it easier to produce a quality product. Unfortunately, as an industry, we have not done a good job of attracting quality young people for today’s production requirements.
Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology
01/23/2025 | John Watson -- Column: Elementary, Mr. WatsonThis year introduces a new generational group, likely to be dubbed Generation Beta, since Generation Alpha was born between 2010 and 2024 and is considered the first generation born in the 21st century. Generation Alpha grew up in a world dominated by smartphones, artificial intelligence, and rapid technological advancements. It is anticipated that Generation Beta will live to see the 22nd century.
All Flex Solutions Upgrades Lamination Layup
01/17/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.