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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)
November 24, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Watch & Learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over 8 minutes, the ninth episode, “AI in Action” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit “Converting Process Data Into Intelligence” and start watching, free, today!
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Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
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