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Advanced Electronics Packaging Digest

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Suggested Items

MKS to Showcase Advanced PCB Technologies at THECA 2026

08/24/2026 | MKS Inc.
During the conference, MKS experts will present two technical presentations addressing closed-loop digital process control and the evolving PCB technology requirements of AI, high-performance computing and data center infrastructure.

Voyager Awarded Raytheon Contract Supporting SM-3

08/06/2026 | BUSINESS WIRE
Voyager Technologies has been awarded a contract by Raytheon, an RTX business, to advance propulsion technologies for the Standard Missile-3 (SM-3®) interceptor family.

Kioxia, Sandisk Develop Highest-Density 3D QLC NAND

08/06/2026 | BUSINESS WIRE
Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation and Sandisk Corporation unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency.

DRAM Supply to Remain Tight in 2027, Prompting NVIDIA to Lower HBM Configurations for Rubin Ultra

08/05/2026 | TrendForce
According to TrendForce's latest memory industry research, DRAM supply will remain tight through 2027, and uncertainty persists over memory suppliers' HBM4e validation timelines.

IEEE Study Demonstrates Full-Wave Simulation of Kerr Frequency Comb Generation

08/03/2026 | PRNewswire
Kerr optical frequency combs are compact light sources used in many applications, including precision measurements to high-speed communications.
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