Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Ram Wissel Details KYZEN Automated Process Control Line
December 1, 2021 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
Nolan Johnson speaks with Ram Wissel, VP, global technology manager, about KYZEN’s work in automated process control with its Process Care Line, designed to offer unmatched automated process management and control with remote reporting capabilities.
Listen to this Real Time with… SMTAI 2021 interview with Ram Wissel now.
If you didn’t make it to SMTA International in Minneapolis, don’t worry. We have interviews with the SMT segment’s top engineers and managers. Visit realtimewith.com now for all the interviews produced by I-Connect007 in partnership with SMTA at this year's event.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
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