-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Releases Intervala Partnership Case Study
December 6, 2021 | Koh YoungEstimated reading time: 2 minutes
Joe Benz, Director of Operations at Intervala says “customers stop at the Koh Young AOI and run through the features, it gives them a warm and fuzzy confident feeling.” This is just one of the phrases the team at Intervala use in this latest case study proudly released by Koh Young, the industry leader in True 3D measurement-based inspection solutions. Intervala is a Pittsburgh-based EMS provider that prides itself on combining the latest innovations with decades of experience and knowledge to fuel their growth and deliver customer satisfaction.
Description automatically generatedThe bond between Koh Young and Intervala has been solid from the start, plus the fact that both companies have similar outlooks and ideals has made that bond all the stronger. The case study covers many reasons that Intervala and Koh Young have become partners and that Intervala relies on Koh Young for all their inspection needs. It also covers the lengths that partners go to when help is needed.
Following a catastrophic flood at an Intervala facility on Christmas Eve, Koh Young received the call for help and responded immediately. Intervala’s first SMT line was back up and running in a new temporary location just five days after the incident. More lines were installed and running before the new year and within 13 days of the flood, all of Intervala’s inspection equipment was operating at full tilt again.
Intervala is an impressive business that really understands where value comes from in terms of using the data derived from their inspection systems to drive better process and business performance. You can read the hard numbers in terms of improvement, as well as understanding where Koh Young is able to deliver on every part of the engagement, now and in the future.
Joe Benz concludes, “the presence of Koh Young on the factory floor has been a real gamechanger, and for our customers it is a differentiator that gives them the confidence that we are able to deliver the quality and consistency they need and expect.” Read the full story at kohyoungamerica.com/case-studies.
To learn more about how our solutions boost your quality, visit us at the IPC APEX Expo in Booths 1717 (Koh Young booth), 1707 (IPC Factory of the Future Pavilion), or Booth 3815 (Poster Session on IPC-CFX) during 25-27 January 2022 at the San Diego Convention Center in San Diego, California.
Koh Young America is excited to reconnect and collaborate in-person, while ensuring COVID safety protocols are implemented and upheld for your health and ours.
Check out this additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download).
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series.
- You can also view other titles in our full I-007e Book library here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.