-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Increases Process Analysis for Assemblies with New Tools and Processes
December 8, 2021 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Rehm Thermal Systems is a technology leader for reflow soldering systems with convection or condensation, and drying and coating systems. Since 1990, it has been one of the most renowned manufacturers when it comes to soldering, coating and curing of assemblies. Customers can benefit from such longstanding experience when it comes to process optimization supported by Rehm’s application specialists. A team of five experts offer full service for determining the optimal manufacturing process or analyzing errors.
Which application is right for me? How can we correct a continuous error, or which process will give me the best soldering result for my component? These are just a few of the questions Rehm Thermal Systems have been asked. You can find the answers to these questions in the company’s Technology Center. To this end, it has been equipped with a complete SMT production line: from a paste printer and placement machine right through to a range of reflow soldering systems, convection, condensation, and contact soldering. A full coating line rounds off the conformal coating portfolio.
Helmut O?ttl’s team (Head of Application and Process Development) takes care of special customer requirements in the 460-m² Technology Center. “Our customers approach us with an application. The SMT production line then gives us the chance to observe the process in detail and set the parameters accordingly. We determine whether convection or condensation soldering – with or without a vacuum process – is best suited to the corresponding application and assembly. This ensures we can prevent potential serial errors during production in advance. It has also set a new benchmark – this service is unique in the industry.”
And that’s not the end of it, Helmut Öttl’s team also helps customers with recurring problems. Our know-how makes us a strong partner for process analysis. Voids, blowholes or other problems can sometimes occur during the soldering process. We are able to completely map and analyze the process in our Technology Center. This allows us to provide customers the best possible support for the troubleshooting process,” continues Öttl.
Moreover, prototypes and small series runs can be produced according to the customer’s orders without any problems. This takes the stress off product development for the customer – nor is high-volume series production interrupted by orders with small batch sizes.
The application specialists at Rehm Thermal Systems are also active beyond the doors of the Technology Center. Process analyses and training can be carried out directly on site at the customers’ facilities worldwide. The experts are equipped with state-of-the-art measuring and camera technology for this. “In particular, we send our application specialists to customers with application areas outside Europe and perform process analysis on site. This saves a lot of time and facilitates communication in these cases,” adds Helmut Öttl.
You are welcome to get in contact at applikation@rehm-group.com to arrange an appointment to analyze and optimize the soldering process at the Rehm Technology Center.
You can find further information about our products on our website at www.rehm-group.com.
Suggested Items
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Apple’s Vision Pro Reshapes the VR/MR Landscape, Driving Applications from Entertainment to Productivity Tools
12/23/2024 | TrendForceTrendForce’s latest report estimates that global shipments of VR and MR headsets are expected to reach approximately 9.6 million units in 2024, representing a YoY increase of 8.8%.
n-hop technologies Limited, OneAsia Network Limited Partner to Revolutionize Data Transfer and Networking Solutions
12/20/2024 | ACN Newswiren-hop technologies Limited, a leader in telecommunications and computer networking innovations, and OneAsia Network Limited (OneAsia), the AI factory enabler with data centres across APAC, have signed a Memorandum of Understanding (MOU) to collaborate on pioneering large data transfer solutions and AI Data Centre networking technologies.