Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions

12/26/2024 | Compal Electronics Inc.
Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.

Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.

12/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030

12/23/2024 | openPR
According to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.

Apple’s Vision Pro Reshapes the VR/MR Landscape, Driving Applications from Entertainment to Productivity Tools

12/23/2024 | TrendForce
TrendForce’s latest report estimates that global shipments of VR and MR headsets are expected to reach approximately 9.6 million units in 2024, representing a YoY increase of 8.8%.

n-hop technologies Limited, OneAsia Network Limited Partner to Revolutionize Data Transfer and Networking Solutions

12/20/2024 | ACN Newswire
n-hop technologies Limited, a leader in telecommunications and computer networking innovations, and OneAsia Network Limited (OneAsia), the AI factory enabler with data centres across APAC, have signed a Memorandum of Understanding (MOU) to collaborate on pioneering large data transfer solutions and AI Data Centre networking technologies.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in