Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Indium Announces Personnel Updates to European Technical Team
December 9, 2021 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is pleased to announce two key personnel updates to its European technical team.
Cristian Tudor has been promoted to the role of Senior Applications Engineer and Ângelo Marques has been appointed Design for Excellence (DfX) Specialist in addition to his current role as an Applications Engineer.
“At Indium Corporation, we are proud to offer career opportunities that allow our employees to learn, grow, and find their perfect fit within the company,” said Brian Craig, managing director of Indium Corporation’s European operations. “I am proud of Ângelo and Cristian’s accomplishments and their ability to assist our customers across Europe.”
Marques’ expertise in automotive electronics, especially in DfX for stencils, PCBs, and complex components, continues to help Indium Corporation's customers shorten DV / PV (design validation / production validation) lifecycles and launch earlier into SOP (Start of Production) with optimized manufacturing processes with reduced defects and increased yields. In addition to his new role as DfX Specialist, Marques continues to provide technical support, share process knowledge, and make recommendations for the use of Indium Corporation’s materials in PCBA throughout Europe’s Latin region as an Applications Engineer. An Indium Corporation employee since 2017, Marques possesses over 25 years of automotive electronics experience in new product introduction and process optimization. He has a Six Sigma Green Belt and is an IPC 610 certified trainer.
Tudor joined Indium Corporation as an applications engineer in 2000. Based in Romania, he uses his 20 plus years of technical expertise to provide PCBA support and process knowledge in Europe’s east region. Tudor works on customer production lines, communicating face-to-face with production and engineering staff to optimize their processes. Tudor is a Certified SMT Process Engineer, earned his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering, and earned his bachelor’s degree in electrical engineering from the Technical University Politehnica of Timi?oara in Romania.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.