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Rehm Thermal Systems to Offer Webinars on a Variety of Topics in 2022
December 10, 2021 | Rehm Thermal SystemsEstimated reading time: 3 minutes
The successful series of webinars will be continued in the same scope in 2022. The experts from Rehm Thermal Systems provide theoretical background knowledge on various topics, peppered with insights into the practical application of Rehm's systems. Take the opportunity to refresh your knowledge, get ideas for innovative projects and gain a comprehensive overview of manufacturing processes in the electronics industry. To ensure that you don't miss any of the dates in your day-to-day business, all the dates for the first half of 2022 have already been put online. You can register directly online at the respective date at https://www.rehm-group.com/aktuelles/termine.html or by e-mail to sales@rehm-group.com.
20.01.2022 / 9:00 a.m. and 4:00 p.m. CET
Live-Webinar: Dispensing & Coating Solutions (English)
The coating technology in the electronics industry continues to advance. The wide range of materials and application methods are specially adapted to the assembly to be produced. It is not easy not to lose the overview here!
In our webinar we will explain to you that selection and implementation of the appropriate procedure does not have to be unnecessarily complicated. Let our experts show you how you too can achieve the perfect material application in just a few steps can.
The German-language webinar on this topic will already take place on January 19th at 9:00 a.m. CET.
10.02.2022 / 9:00 a.m. and 4:00 p.m. CET
Live-Webinar: Reduction of voids with vacuum (English)
Vacuum soldering has been a proven technique for decades in contactheat and vapour phase soldering systems, significantly reducing gasbubbles in solder joints.
What does this mean in terms of convection soldering, though, the most widely used and highest throughput soldering technique today?
The German-language webinar on this topic will already take place on February 9th at 9:00 a.m. CET.
03.03.2022 / 9:00 a.m. and 4:00 p.m. CET
Live-Webinar: Vapor Phase Soldering (English)
Do you process large and heavy boards for which convection soldering is out of the question? Or do you want a system that you can reliably carry out vacuum processes with at any time? Then choose a Condenso series system that can be customised to your manufacturing environment!
The Condenso series system versions can be integrated into a wide range of manufacturing environments. Whether it’s a batch operation, inline connection or continuous soldering, Rehm offers the highest degree of process reliability for all areas.
The German-language webinar on this topic will already take place on March 2nd at 9:00 a.m. CET.
24.03.2022 / 9:00 a.m. and 4:00 p.m. CET
Live-Webinar: Solutions for the reduction of CO2 in electronics manufacturing (English)
The avoidance or reduction of CO2 emissions in production actively contributes to counteracting the advancing climate change. By optimising the design of Rehm systems and using smart software, the CO2 caused by the production of electronics can be significantly reduced.
Rehm offers a wide variety of solutions for different applications. Our customers produce a wide range of products and require individual solutions to improve their company-specific CO2 footprint.
The German-language webinar on this topic will already take place on March 23rd at 9:00 a.m. CET.
07.04.2022 / 9:00 a.m. and 4:00 p.m. CEST
Live-Webinar: Nexus High Temperature Contact Soldering (English)
Contact soldering with vacuum is best suited for void-free soldering of various components (e.g. IGBT) on DCB substrates.
In this webinar you will learn about the possibilities of contact soldering under vacuum and experience the ease of use of the Nexus contact soldering system live in action.
The German-language webinar on this topic will already take place on April 6th at 9:00 a.m. CET.
28.04.2022 / 9:00 a.m. and 4:00 p.m. CEST
Live-Webinar: Nitrogen Soldering (English)
Without a doubt, convection soldering in a nitrogen atmosphere has been enjoying triumphant expansion throughout the world since the 1990s.
The benefits of soldering in nitrogen – a larger solder working window, fewer soldering defects and the ability to avoid the oxidation of surfaces, were gladly taken advantage of not only in the “lead age” as well.
The German-language webinar on this topic will already take place on April 27th at 9:00 a.m. CEST.
02.06.2022 / 9:00 a.m. and 4:00 p.m. CEST
Live-Webinar: ProMetrics (English)
ProMetrics was developed for monitoring thermal profiles when soldering electronic assemblies. It checks how well the created profile meets the required, predefined specifications.
An envelope graph visualises deviations of the temperature profile from the predefined temperatures. ProMetrics can be used for single and double track systems with and without vacuum.
The German-language webinar on this topic will already take place on Juni 1st at 9:00 a.m. CEST.
The duration of these webinars is 60 min. Participation is free of charge.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.