Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
MacDermid Alpha to Exhibit, Present at TPCA and IMPACT
December 14, 2021 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Maddux Sy, Applications Manager for the Metallization group, will be presenting “ RDL and Pillar Fabrication from a Versatile Copper Plating Process“. The paper discusses the challenges fabricators face not only in meeting the copper plating performance requirements but also in reducing manufacturing process costs.
Interested participants can stop by booth K606 in Hall 1 to talk to our industry experts about the latest offerings from MacDermid Alpha. Featured in the booth will be the MacDermid Enthone brand of product offerings that enable the most complex printed circuit board and IC Substrate designs. Highlighted will be the entire Systek family of high performance build-up processes for IC Substrate RDL that provide multiple process flows for differet materials, Affinity 2.0, the new Affinity Gold 3.0 and the soon to be released Affinity Select, the OSP compatible selective ENIG process. Also featured will be the full portfolio of MacuSpec acid copper products that meet all applications, from ultra-aspect ratio conformal plating down to filling the smallest blind microvias.
Share on:
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.