Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile UltrasoundDesign
December 15, 2021 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Butterfly Network, Inc. has successfully deployed the Cadence Clarity 3D Solver to support and enhance the design of its handheld, single-probe, whole-body ultrasound system. The Clarity 3D Solver is used as part of Butterfly’s system design and analysis workflow for its speed and capacity, which eliminate the need to partition the design and sacrifice accuracy to extract the circuit’s electromagnetic behavior.
With the Clarity 3D Solver, Butterfly was able to achieve a 5X speedup in advanced model characterization with gold-standard accuracy compared to an alternative solution. Additionally, the Clarity 3D Solver enables the team to optimize their designs and ensure the critical signal and power integrity of their system, delivering high-quality ultrasound images to the connected smart device at top speeds.
“We build advanced assessment technology to unlock clinical information to enable better diagnosis and treatment decisions,” said Nevada Sanchez, co-founder and engineering VP of Butterfly Network. “The Cadence front-to-back system design and analysis flow enables our engineers to identify design problems quickly and accurately and, more importantly, allows us to get products to the field sooner.”
“The unique role our products play in effectively simulating and optimizing Butterfly’s complex technology and enabling delivery to the healthcare market as quickly as possible is highly rewarding,” said Ben Gu, vice president of multiphysics system analysis in the Custom IC & PCB Group at Cadence. “We look forward to continuing to partner with Butterfly to design critically important next-generation medical equipment using the complete robust design and analysis capabilities provided by our Virtuoso, Allegro X, Clarity, Celsius and Sigrity X technologies.”
The Clarity 3D Solver supports the Cadence Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
05/01/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.