-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Butterfly Network Leverages Cadence Clarity 3D Solver for Advanced Mobile UltrasoundDesign
December 15, 2021 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Butterfly Network, Inc. has successfully deployed the Cadence Clarity 3D Solver to support and enhance the design of its handheld, single-probe, whole-body ultrasound system. The Clarity 3D Solver is used as part of Butterfly’s system design and analysis workflow for its speed and capacity, which eliminate the need to partition the design and sacrifice accuracy to extract the circuit’s electromagnetic behavior.
With the Clarity 3D Solver, Butterfly was able to achieve a 5X speedup in advanced model characterization with gold-standard accuracy compared to an alternative solution. Additionally, the Clarity 3D Solver enables the team to optimize their designs and ensure the critical signal and power integrity of their system, delivering high-quality ultrasound images to the connected smart device at top speeds.
“We build advanced assessment technology to unlock clinical information to enable better diagnosis and treatment decisions,” said Nevada Sanchez, co-founder and engineering VP of Butterfly Network. “The Cadence front-to-back system design and analysis flow enables our engineers to identify design problems quickly and accurately and, more importantly, allows us to get products to the field sooner.”
“The unique role our products play in effectively simulating and optimizing Butterfly’s complex technology and enabling delivery to the healthcare market as quickly as possible is highly rewarding,” said Ben Gu, vice president of multiphysics system analysis in the Custom IC & PCB Group at Cadence. “We look forward to continuing to partner with Butterfly to design critically important next-generation medical equipment using the complete robust design and analysis capabilities provided by our Virtuoso, Allegro X, Clarity, Celsius and Sigrity X technologies.”
The Clarity 3D Solver supports the Cadence Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).