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Indium Corporation Experts to Present at IPC APEX Expo
December 15, 2021 | Indium CorporationEstimated reading time: 1 minute
Four Indium Corporation experts will share their industry insight and knowledge on topics including thermal interface materials, electronic materials, and solder alloys and processes at IPC APEX Expo, Jan. 25-27, San Diego, California, U.S.
The following technical papers from Indium Corporation’s technical experts will be featured:
- “Study of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials” by Guangyu Fan, Ph.D., research chemist
- “Solid Liquid Hybrid TIMs – Part II: The Power of m2TIMs” by Miloš Lazi?, product development specialist
- “Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC Module Applications” by Dr. Fan
- “A Novel Epoxy Flux for Preventing VIPPO Hot Tear Defects” by David Bedner, research chemist
- “Lead-Free Low-Temperature Solder Paste for Drop Shock Critical Applications” by HongWen Zhang, Ph.D., R&D manager, alloy group
Lazi? will also chair a track on solder alloys and processes.
For more information about Indium Corporation’s technical knowledge, innovative materials solutions, and experts, visit booth #3046 at the show.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
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