-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Alun Morgan's productronica Slide Show
December 15, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

I-Connect007 has been bringing you interviews with a variety of technologists who attended last month's productronica show in Munich, Germany. As part of our continuing coverage of productronica 2021, we present this exclusive slide show of photos taken by our good friend Alun Morgan, technology ambassador for Ventec International Group and a fantastic photographer in his own right. Rumor has it that Lufthansa made him buy a separate seat for that giant camera of his.
Now, without further ado, please enjoy Alun's photo coverage of productronica 2021.
Suggested Items
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
03/07/2025 | VentecVentec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.
Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA
02/14/2025 | VentecVentec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
12/17/2024 | Ventec International GroupVentec International Group Co., Ltd. announces that Thailand has been selected as the location for its new state-of-the-art PCB materials manufacturing facility.
Ventec to Become Primary PCB Materials Supplier for Teltonika
11/13/2024 | VentecVentec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.