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Inventec Enhances Server and Notebook Design for Manufacturing Excellence with Siemens’ Software
March 3, 2026 | SiemensEstimated reading time: 2 minutes
Siemens announced Inventec Corporation, a global leader in high-tech electronics and server manufacturing, has adopted Siemens’ Valor™ NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen design-for-manufacturing (DFM) efficiency and production quality across its server and notebook product lines.
Solving manufacturing issues before production
Inventec is a major Taiwan-based original design manufacturer (ODM) and original equipment manufacturer (OEM) that designs and manufactures notebooks, servers and other electronic devices for leading global brands. As the complexity of server and AI-driven hardware designs increases, the gap between design and manufacturing becomes a critical bottleneck. Realizing this, Inventec sought a scalable, automated approach to improve its early-stage manufacturing readiness and production quality.
By adopting Siemens’ Valor NPI, Inventec has embedded automated DFM verification into its development workflow, enabling engineering teams to identify and resolve manufacturing issues before production. This shift has helped Inventec significantly reduce late-stage design changes, improve first-pass yield and cut EQ from PCB and assembly partners by more than 50 percent.
“Our goal is to deliver cutting-edge server and notebook technology to our customers with speed and precision,” said Barry Chen, senior ECAD manager, Inventec Corporation. “With Siemens’ software, we’ve moved away from manual, document-based processes to a fully digitalized workflow. This has allowed us to identify and resolve potential manufacturing issues before production begins, accelerate time-to-market, reduce engineering change cycles and enhance collaboration between design and manufacturing teams.”
Fast error-free SMT readiness
In parallel, Inventec implemented Siemens’ Process Preparation X to streamline surface-mounted technology programming and digital work instruction generation, creating a unified programming environment across multiple SMTs, reducing manual data conversion and preventing polarity, offset and placement errors through virtual validation. As a result, Inventec achieved earlier detection of DFM and equipment-related issues before pilot runs, accelerated SMT program preparation by up to 50 percent, enabled automated and error-free generation of more than 20,000 production work instructions annually and improved consistency and quality across its global manufacturing operations.
“Electronics manufacturers are under increasing pressure to deliver highly complex products faster, with uncompromised quality,” said AJ Incorvaia, senior vice president and general manager, Electronic Board Systems, Siemens Digital Industries Software. “By adopting Siemens’ portfolio, Inventec has transformed its DFM operations to unlock new levels of operational excellence and gained significant productivity boosts to its SMT programming and work instruction generation workflow.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.