-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ventec Expands Manufacturing Footprint with New Thailand Facility Supporting “China + Taiwan Plus One” Supply Chains
March 12, 2026 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group today provided an update on the progress of its new manufacturing facility in Thailand, which is scheduled to come on stream in Q2 2026, marking an important step in the company’s strategy to diversify global production and support customers seeking China & Taiwan plus one supply chain resilience.
The new facility, which will ramp up progressively between 2026 and 2028, will expand Ventec’s manufacturing capability for advanced prepreg, bond-ply and laminate materials used in high-reliability PCB applications across aerospace, defence, industrial, medical and other mission-critical sectors. The investment reflects Ventec’s strategy to remain an agile, right-size manufacturer in an increasingly polarising CCL and prepreg supply chain.
The Thailand site will include up to eight vertical treaters and two horizontal treaters dedicated to advanced prepreg production. At full ramp-up, the facility is expected to deliver approximately 3.0 million square meters of prepreg capacity per month, together with 80,000 square meters of bond-ply capacity.
In addition, the facility will incorporate high-mix, mid-volume press capacity designed to support advanced FR4 and specialty laminate systems, complementing Ventec’s existing manufacturing operations in China and Taiwan.
By 2028, the expansion will contribute to an increase in Ventec’s global lamination capacity to approximately 1.8 million square meters per month, strengthening supply chain resilience for customers in Southeast Asia and worldwide.
Mark Goodwin, Chief Commercial Officer of Ventec International Group, commented:
“We are seeing a structural shift in the PCB materials supply chain. Increasingly, some laminators are concentrating capacity on hyperscale AI infrastructure and IC substrate markets. That leaves many customers in high-reliability, high-mix sectors needing partners who remain focused on their requirements.
Ventec’s strategy is to be the right-size manufacturer with the agility and product breadth to support those applications. Expanding our manufacturing footprint in Thailand strengthens our China & Taiwan plus one strategy and provides customers with greater supply chain resilience and optionality.
In a market that is becoming more polarised, our focus remains clear: delivering advanced materials, secure supply, and the flexibility needed to support mission-critical electronics programmes worldwide.”
The Thailand facility represents the next step in Ventec’s long-term strategy to build a diversified, agile manufacturing network capable of supporting customers globally with high-performance laminate and prepreg materials.
Forward-Looking Statement Disclaimer
This announcement contains forward-looking statements regarding potential future facilities and investments. Actual results may differ materially from those projected. The Company undertakes no obligation to publicly update or revise any forward-looking statements. Any final investment decision would be subject to Board approval and announced in accordance with applicable laws and regulations.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BAE Systems Honors Flip Electronics with a Partner 2 Win Gold Tier Award
04/10/2026 | PRNewswireFlip Electronics, a global authorized distributor of electronic components specializing in obsolescence mitigation and hard-to-find parts, announced it received a Gold Tier Award from BAE Systems' Partner 2 Win program.
Accelerating Electronic Supply Chains With Luminovo
04/09/2026 | Real Time with... APEX EXPOTimon Ruban, founder of Luminovo, explains how his company's electronic supply chain platform is revolutionizing the quoting process for contract manufacturers, reducing BOM pricing time from days to under an hour. Learn about their AI strategy and vision for coordinating company knowledge work through supply chain data in this interview.
Limited Capacity, Order Shifts Drive March Consumer DRAM Price Surge, Led by Sub-4Gb Products
04/07/2026 | TrendForceMajor suppliers are continuing to phase out production of mature products below DDR4, according to TrendForce’s latest research on the memory industry.
Nanya Technology Secures $2.5 Billion to Expand Advanced Memory Production Amid AI-Driven Shortage
04/02/2026 | I-Connect007 Editorial TeamTaiwanese memory chipmaker Nanya Technology saw its shares jump to the daily limit of 10% following the announcement of a $2.5 billion private placement from investors SanDisk, HK Hynix, Cisco Systems and Kioxia, aimed at boosting its advanced chip manufacturing capacity.
Kodiak Assembly Solutions Strengthen Domestic PCB Supply Chain Amid AI-Driven Market Pressures
03/30/2026 | Kodiak Assembly SolutionsKodiak Assembly Solutions LLLP, a leading electronics contract manufacturer, announced a strategic initiative to strengthen its PCB supply chain through partnerships with U.S.-based manufacturers, helping customers navigate increasing material constraints driven by rapid growth in artificial intelligence (AI) infrastructure.